Intel Pentium
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.v
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
| Processor familie | Intel Pentium |
| Processor frekvens | 3.0 GHz |
| Processor antallet af kerner | 2 |
| Processor socket | Socket H2 (LGA 1155) |
| Component for | PC |
| Processor lithografie | 22 nm |
| Boks | Nej |
| Processortype | G2030 |
| Antal tråde | 2 |
| Systembus | 5 GT/s |
| Processor operating modes | 64-bit |
| L3 cache | 3 MB |
| Compatible chipsets | Intel B65 Express, Intel H61 Express, Intel H77 Express, Intel Q75 Express, Intel Q77 Express, Intel Z75 Express, Intel Z77 Express |
| Stepping | P0 |
| L3 cache speed | 3.0 GHz |
| Bus type | DMI |
| Maximum RAM supported | 32 GB |
| Understøttet hukommelsestyper | DDR3-SDRAM |
| Supported memory clock speeds | 1333 MHz |
| Muistin suurin siirtonopeus | 21 GB/s |
| Memory channels support | Dual |
| ECC | Ja |
| On-board graphics adapter | Ja |
| On-board graphics adapter model | Intel HD Graphics |
| Graphics base frequency | 650 MHz |
| Graphics max dynamic frequency | 1050 MHz |
| Potenza termica | 55 W |
| Execute Disable Bit | Ja |
| Idle States | Ja |
| Thermal Monitoring Technologies | Ja |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
| Seturi de instrucţiuni Supported | SSE4.1, SSE4.2 |
| Number of displays supported | 3 |
| CPU configuration (max) | 1 |
| IMC lithography | 22 nm |
| Коробка в упаковке | PCG 2011С |
| Intel Smart Cache | Ja |
| Enhanced Intel SpeedStep Technology | Ja |
| Intel Virtualization Technology | VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Ja |
| Бесконфликтная продукция | Ja |
| dimensioni del pacco | 37.5 x 37.5 mm |
| Code de processeur | SR163 |
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